| 摘要 |
PROBLEM TO BE SOLVED: To obtain a silicone rubber composition having thermal conductivity and capable of providing a silicone rubber molding product having high thermal conductivity and low hardness by decreasing rise in viscosity of a liquid silicone rubber composition caused by addition of a large amount of alumina (aluminum oxide) to improve its moldability and processability and curing it. SOLUTION: This composition comprises (A) 100 pts.wt. alkenyl group- containing organopolysiloxane having <=500,000 cs viscosity at 25 deg.C, (B) 300-1,200 pts.wt. aluminum oxide powder, (C) 0.05-10 pts.wt. alkoxysilane shown by the formula R1aSi(OR2)(4-a) (R1 is a 6-20C nonsubstituted or substituted monofunctional hydrocarbon group; R2 is a 1-6C alkyl; (a) is 1, 2 or 3.), (D) a platinum group metal catalyst, (E) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in a molecule as main components and the molar ratio of SiH group in the component (E) to the alkenyl group in the component (A) is within the range of 0.05/1-3/1. |
