| 摘要 |
PROBLEM TO BE SOLVED: To enhance clearance permeability for sealing a slight clearance between a substrate and an IC chip by a method wherein fused spherical silica having specified particle size characteristics is arranged to a liquid epoxy resin or silicon resin at a standard temperature. SOLUTION: Particles having a liquid epoxy resin, or silicon resin A at a standard temperature and the maximum particle size 24μm, the average particle size 2 to 7μm, 1μm or less have a particle size distribution of 1% or less of the entire, and a fused spherical silica filler B having a BET ratio surface area 3 m2/g or less is contained. A viscosity at 50 deg.C of a mixture in which a ratio of a component B occupied in a total amount of a component A and the component B is 80 wt.% at a maximum is 20 Pa.s (200 poise) or less, preferably 18 Pa.s or less. Furthermore, in this liquid sealing fused spherical silica, Na ions and Cl ions in boiling extracted water are respectively 1 ppm or less as ionic impurities, and U and Th are respectively 1 ppb or less as radiant impurities, preferably.
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