| 摘要 |
<p>PROBLEM TO BE SOLVED: To fit a heat sink for a plurality of semiconductor chips in one step, by a method wherein fitting of the heat sink on a rear face side of the semiconductor chip is performed prior to a step of dividing the chip into sections. SOLUTION: An elastic resin 4 is mounted in a region excluding an electrode 3 provided in unit of a chip 2 on one face of a wafer 9. Next, a polyimide substrate 5 forming conductive patterns on one face is fitted on a surface of this elastic resin 4. And, the conductive pattern of this polyimide substrate 5 is processed to form a lead 6, which is connected to the electrode 3 of the semiconductor chip 2, and further an opening part H is formed at a position corresponding to the conductive pattern on a surface of the polyimide substrate 5. Further, a periphery of the lead 6 is sealed with a encapsulation resin 7, and a solder ball 8 is mounted in the opening part H of the polyimide substrate 5. Thereafter, a wafer 9 is divided in unit of each semiconductor chip 2 by a dicing sow of a dicing machine.</p> |
