| 摘要 |
<p>PROBLEM TO BE SOLVED: To safely and surely separate an area array package soldered to a printed wiring board from the printed wiring board. SOLUTION: An area array package ejector 3 is used, which includes a package pinching part 1 made of a metal thin plate substantially shaped like U-letter in cross section and a spring part 2 made of a metal thin plate shaped substantially like inverted letter L in cross section, in which the top of the spring part 2 is fixed to the top of the package pinching part 1, so that the spring of the spring part 2 is positioned at the back of the package pinching part 1. An area array package is inserted into a reflow-soldering unit in a state of being pinched by a pair of area array package ejectors 3 with a force for lifting the area array package from a printed wiring board applied and is heated to melt solder and then heating is stopped to lower temperature until the temperature is below the solidifying point, whereby the area array package is separated from the printed wiring board.</p> |
