| 摘要 |
<p>PROBLEM TO BE SOLVED: To contrive to enhance reflow-resistant characteristics, by a method wherein, by use of a film material when adhering a wiring tape to a semiconductor element in an insulative manner, a specified modulus of elasticity is made in the reflow temperature region. SOLUTION: In a step of forming an external terminal 2.5 by a solder ball, etc., for connecting with a mounting substrate, or a solder reflow step for mounting a semiconductor element 2.3 on the mounting substrate, since a reflow temperature is processed at a high temperature of 200 to 250 deg.C, moisture is evaporated in a moisture absorbed semiconductor device, and a film material swells with the vapor pressure, with the result that a foaming atmosphere occurs, and defects such as voids, releasing, or the like occur. For this reason, as physical properties of an adhesive film material 2.2, a modulus of elasticity in a temperature region (200 to 250 deg.C) of mounting reflow conditions is set to be 1 Mpa or more. Thus, it is possible to enhance reflow-resistant characteristics.</p> |
