| 摘要 |
PROBLEM TO BE SOLVED: To intensionally retain a width of a second bonding face while facilitating a multi-pin structure, by a method wherein the second bonding face at a frontal end of an inner lead part positioned on the lower side projects to a direction of a pad rather than the second bonding face at a frontal end of the inner lead part positioned on the upper side. SOLUTION: Respective inner lead parts 12a, 31a in a base part lead flame 1 and an upper lead flame 3 are formed at the substantially same pitch so as to be vertically overlaid on each other, and also the inner lead part 31a is formed at a shorter length than the inner lead part 12a so that a second bonding face 12b at a frontal end of the inner lead part 12a positioned on the lower side projects to a direction of a pad 10 rather than a second bonding face 31b at a frontal end of the inner lead part 31a positioned on the upper side. An insulation tape 2 comprises an opening part 2a for exposing the pad 10 and the second bonding face 12b at a center part, and the base part lead frame 1 is insulated from the upper lead flame 3, mutually. |
