| 摘要 |
PROBLEM TO BE SOLVED: To enable forming a small-sized laminated chip component whose conductor width is at most 30μm by screen printing. SOLUTION: A plurality of coil patterns 2b which are arranged on the same surface, interposing electrical insulation layers are sequentially printed and laminated, and a plurality of round coils are formed, which are cut by a chip unit. External electrodes to which the end portions of the round coils are led out are formed on both ends of each chip, and a laminated chip component is formed. A plurality of the chips are mutually arranged adjacent, and the coil pattern 2b of one chip and the coil pattern 2b of the adjacent chip are printed collectively. Thereby pattern printing widths A and B can be widened twice the coil width, so that a ultra-thin round coil can be formed by screen printing.
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