| 发明名称 |
CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD FOR USING SAME |
| 摘要 |
An aqueous chemical mechanical polishing slurry useful for polishing the polysilicon layer of a semiconductor wafer comprising an aqueous solution of at least one abrasive, and at least one alcoholamine. The slurry preferably has a pH of from about 9.0 to about 10.5 and it includes an optional buffering agent.
|
| 申请公布号 |
WO0000560(A2) |
申请公布日期 |
2000.01.06 |
| 申请号 |
WO1999US14558 |
申请日期 |
1999.06.25 |
| 申请人 |
CABOT CORPORATION |
发明人 |
STECKENRIDER, J., SCOTT;MUELLER, BRIAN, L. |
| 分类号 |
B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/304;H01L21/321;(IPC1-7):C09G/ |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
