Mechanical and electric coupling integrated circuits

摘要

The integrated circuits are coupled together or to active or passive electronic or mechanical components. Connection is carried out by layered solidifying of liquid photohardening plastics. During the laminated buildup of the module are formed recesses for retaining the system components and connection ducts for the electrically conductive links between the embedded system components, with the latter arranged in several planes. The process uses conductive track masks, removed by plasma etching.