| 发明名称 |
Die attach adhesives for use in microelectronic |
| 摘要 |
<p>A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.</p> |
| 申请公布号 |
EP0969065(A2) |
申请公布日期 |
2000.01.05 |
| 申请号 |
EP19990112734 |
申请日期 |
1999.07.01 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
HERR, DONALD;SCHULTZ, ROSE ANN;XU, PING YONG;MCLAUGHLIN, SCOTT R. |
| 分类号 |
H01L21/52;C08F22/40;C08F290/06;C08F299/00;C08G18/28;C08G18/75;C08G77/42;C09J4/00;C09J4/06;C09J177/00;C09J179/08;C09J183/10;H01L21/60;H05K3/30;(IPC1-7):C09J4/00;C08F299/02;H05K3/38 |
主分类号 |
H01L21/52 |
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