发明名称 |
Thermoelectric module and solder for use in its manufacture |
摘要 |
<p>A thermoelectric module contains a P-type semiconductor element and an N-type semiconductor element electrically connected in series to each other in a circuit containing a conductor and a solder layer. The solder is formed from a ternary eutectic alloy composition containing bismuth in an amount of from 5 to 70 atomic %, tin in an amount of from 20 to 70 atomic % and antimony in an amount of from 5 to 70 atomic %. The solder composition provides the thermoelectric module with improved high temperature performance and enables the semiconductor elements to be directly contacted with the soldering layer without the necessity of a barrier layer. <IMAGE></p> |
申请公布号 |
EP0969525(A1) |
申请公布日期 |
2000.01.05 |
申请号 |
EP19990201755 |
申请日期 |
1999.06.02 |
申请人 |
TELLUREX CORPORATION |
发明人 |
CAUCHY, CHARLES J.;WERTENBERGER, LARRY W. |
分类号 |
B23K1/00;B23K35/22;B23K35/26;C22C12/00;C22C13/00;C22C13/02;H01L35/08;H01L35/10;H01L35/16;H01L35/32;(IPC1-7):H01L35/08 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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