发明名称 |
Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung |
摘要 |
A chip module (1) for installation in a chip card carrier, comprising a semiconductor chip (5) and a leadframe (2) in the form of a metal layer. An adhesive layer (11) is provided in between the metal layer and the semiconductor chip (5), whereby said adhesive is flowable in a non-hardened state and spreads on the basis of capillary action. The semiconductor chip (5) is covered with a hotmelt adhesive (7) layer extending from the leadframe (2). |
申请公布号 |
DE19828653(A1) |
申请公布日期 |
2000.01.05 |
申请号 |
DE1998128653 |
申请日期 |
1998.06.26 |
申请人 |
SIEMENS AG |
发明人 |
PUESCHNER, FRANK;HEINEMANN, ERIK |
分类号 |
G06K19/077;H01L23/16;H01L23/495;H01L23/498 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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