Semiconductor device having semiconductor chip with backside electrode

摘要

A semiconductor chip (11) is mounted on a chip-mounting section (12). A conduction path forming section (20) having a plurality of conduction paths (24) formed therein is placed around the chip-mounting section (12). A heat sinking board (14) is bonded to the backsides of the chip-mounting section (12) and the conduction path forming section (20). In the conduction path forming section (20), a second insulating layer (22) is formed with notches (25), whereby the exposed area of conduction paths (24) that are wire-bonded to the chip-mounting section (12) is increased.