发明名称 |
WAFER PRODUCT AND PROCESS OF MANUFACTURE |
摘要 |
A crisp, approximately circular wafer product is provided whereby the two surfaces of the wafer each has a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45~ to the other, the second surface having a single grid pattern, the pattern being at 45~ to the lower grid on the first surface. |
申请公布号 |
EP0967881(A1) |
申请公布日期 |
2000.01.05 |
申请号 |
EP19980910660 |
申请日期 |
1998.02.13 |
申请人 |
UNILEVER PLC;UNILEVER N.V. |
发明人 |
REEVES, JOANNA CATHERINE;TRICARICO, VITO ANTONIO, JR. |
分类号 |
A21D8/06;A21D13/00;A21D13/08;A21D15/00 |
主分类号 |
A21D8/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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