DEVICE FOR DISSIPATING HEAT FROM A HEAT SOURCE LOCATED IN A HOUSING

摘要

According to the invention, the device has a primary cooling element (K1) located inside a housing (G) and a secondary cooling element (K2) located outside the housing (G). The cooling elements are connected via a heat conduction element (P), in order to dissipate heat from the housing (G), said connection being heat-conductive and mechanically moveable. The inventive device for dissipating heat has the particular advantage of drastically reducing the risk of hairline cracks forming in the heat conduction element (P) as a result of vibrations, and could therefore be used effectively in an industrial environment.