| 摘要 |
<p>The method involves the smart card being fabricated with the microcircuit mounted in a cavity having a lateral extension (16) into the region of the card (11) carrying the antenna (25). The cavity and its extension are filled with an electrically insulating material, (22) while the antenna and the microcircuit are connected by conductive tracks (17,18), one of which extends into the cavity extension.</p> |
