发明名称 |
Multilevel interconnect structure for integrated circuits |
摘要 |
A multilevel interconnect structure includes a lower conducting layer, a dielectric layer formed on the lower conducting layer, an upper conducting layer formed partly on the dielectric layer, and an I-shaped via plug for electrically connecting the lower conducting layer and the upper conducting layer. The I-shaped via plug has an upper portion which laterally extends into the upper conducting layer, and a lower portion which undercuts the lower conducting layer.
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申请公布号 |
US6011311(A) |
申请公布日期 |
2000.01.04 |
申请号 |
US19980059938 |
申请日期 |
1998.04.14 |
申请人 |
NAN YA TECHNOLOGY CORPORATION |
发明人 |
HSING, EDWARD HSIEN-SHENG;HONG, JEN-DER |
分类号 |
H01L23/522;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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