Method for removing silicon nitride in the fabrication of semiconductor devices

摘要

A method for use in the fabrication of semiconductor devices in accordance with the present invention includes providing a silicon nitride region and oxidizing a region of material in proximity to the silicon nitride region. The silicon nitride region is then hydrogenated and thereafter, the hydrogenated silicon nitride region is removed. The hydrogenation step may include immersing the silicon nitride region into pressurized boiling water and/or treating the silicon nitride region with pressurized water vapor and the removing step includes removing the hydrogenated silicon nitride region with hot phosphoric acid. The method may be used in a local oxidation of silicon process. Further, the oxidation of the material and the hydrogenation of the silicon nitride may be performed in the same pressurizable unit.