发明名称 Semiconductor integrated circuit device
摘要 A semiconductor integrated circuit device includes: a base film made of insulating material; a wiring pattern of a predetermined shape formed on the base film; a semiconductor chip provided on the base film, wherein an electrode terminal of the semiconductor chip comes into contact with one end of the wiring pattern; and a flexible protective film having an insulating property, the flexible protective film being adhered onto the base film while it covers the semiconductor chip and one end of the wiring pattern.
申请公布号 US6011300(A) 申请公布日期 2000.01.04
申请号 US19970919047 申请日期 1997.08.27
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 MURAMATSU, SHIGETSUGU
分类号 H01L21/60;G01R31/28;H01L21/56;H01L23/28;H01L23/31;H01L23/498;(IPC1-7):H01L23/495 主分类号 H01L21/60
代理机构 代理人
主权项
地址