发明名称 |
Semiconductor integrated circuit device |
摘要 |
A semiconductor integrated circuit device includes: a base film made of insulating material; a wiring pattern of a predetermined shape formed on the base film; a semiconductor chip provided on the base film, wherein an electrode terminal of the semiconductor chip comes into contact with one end of the wiring pattern; and a flexible protective film having an insulating property, the flexible protective film being adhered onto the base film while it covers the semiconductor chip and one end of the wiring pattern.
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申请公布号 |
US6011300(A) |
申请公布日期 |
2000.01.04 |
申请号 |
US19970919047 |
申请日期 |
1997.08.27 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAMATSU, SHIGETSUGU |
分类号 |
H01L21/60;G01R31/28;H01L21/56;H01L23/28;H01L23/31;H01L23/498;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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