| 摘要 |
The card is fabricated on a base (12) of thermoplastic material with a semiconductor chip (20) inserted into the base by hot pressing so that the top of the chip is flush with the surface of the card. A metaled deposit (28) on the top surface of the base forms an antenna. The base is then covered with a film (32) of a thermoplastic material so the chip and the antenna are covered |
