| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin, small and lightweight semiconductor device excellent in heat dissipation in which cost can be reduced by eliminating the need of shaping a lead frame. SOLUTION: The semiconductor device is provided with a device hole 6 and a plurality of outer lead holes 7 at specified positions of an insulating resin film 5 and a copper wiring layer 8 having a die pad part 8a for closing the device hole 6 and a plurality of contact pad parts 8b for closing the outer lead holes 7 while covering individually is formed on one major surface. A face-up semiconductor chip 9 is die bonded onto the die pad part 8a on the other major surface side of such a wiring film and the electrode terminals 9a thereof are connected with the contact pad parts 8b for closing the outer lead holes 7 through bonding wires 11. Furthermore, a mold resin sealing layer 12 of epoxy resin, or the like, is provided on the outside of the semiconductor chip 9 and the bonding wires 11. |
