| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board where the degree of adhesion to resin at connections is lowered. SOLUTION: In a build-up printed wiring board, the adhesion treatment of a copper foil other than the connection part of the via hole connection land of a lower layer is selectively performed, thus improving the adhesive property of an insulation layer circuit pattern and lowering the adhesion property only at the connections of the via hole connection land and hence coaxially forming a via hole for forming the via hole. More specifically, a process for forming a blackening treatment mask 7 by photo method for performing selective adhesion treatment and a process for forming a blackening non-treatment part 9 at a connection part to an upper-layer via hole by eliminating the blackening treatment mask 7 are included. |
