| 摘要 |
PROBLEM TO BE SOLVED: To form a highly reliable phase window and a connection pad in an integrated circuit, by removing a part of a reflection suppression film prior to wire bonding, and leaving a part of a dielectric layer on a phase in an etching process used for removing a part of the reflection suppress film. SOLUTION: The exposed part 42 of a reflection suppression film 28 and the exposed part 40 of a dielectric layer 20 are etched prior to wire bonding. A part 44 of a conduction layer 26 is exposed and a phase window 45 on a phase 16 is formed. Thus, a wire is highly reliably connected to a bonding pad 30. In an etching process, a part 46 of the dielectric layer 20 on the phase 16 is left. Namely, the exposed part 42 and the exposed part 40 are simultaneously etched at same speed in the etching process. Thus, the phase is highly reliably formed. Consequently, the phase 16 is not exposed to an outer environment and the invasion of the phase 16 is suppressed. |
