发明名称 LEAD STRUCTURE FOR AUTOMATICALLY MOUNTED PARTS
摘要 <p>PROBLEM TO BE SOLVED: To eliminate the expansion and burst of sealed air when cream solder is heated by providing leads which are protruded from a molded main body, and have bent sections at their front ends by forming holes through the bent sections. SOLUTION: Flat metallic plates are protruded from the main body 2 of a molded plastic member, ceramic member, etc., as leads 1 and the bent sections 1a of the leads 1 are connected to a printed wiring board in contacting states. At the time of connecting the bent sections 1a to the wiring board, the bursting of cream solder and the formation of solder balls are prevented by forming holes 5 through the bent sections 1a of the leads 1 so that the air sealed between the rear surfaces 4 of the bent sections 1a which are brought into contact with the wiring board and cream solder may be discharged through holes 5. Therefore, the occurrence of unsoldered spots and solder balls can be reduced.</p>
申请公布号 JPH11354703(A) 申请公布日期 1999.12.24
申请号 JP19980155007 申请日期 1998.06.03
申请人 NEC SAITAMA LTD 发明人 SEKINE MASAHITO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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