发明名称 HEATER FOR HEATING WAFER
摘要 <p>PROBLEM TO BE SOLVED: To provide a heater for heating a wafer in which the uniformity of the temperature distribution of a wafer can be made excellent, and costs required for manufacture and maintenance can be reduced. SOLUTION: A heater is composed of 8 heater units 11-18 equipped with the same rectangular plane shape. The four heater units 15-18 are arranged at positions corresponding to each circular arc obtained by equally dividing an outside dimension line 7 of a wafer 1 in a circumferential direction so that the longitudinal line of the rectangular shape can be made vertical to the diameter direction of the wafer 1. The other four heat units 11-14 are arranged between the heater units 15 and 16 positioned so as to be separated from each other at 180 deg. in the circumferential direction among the four heater units 15-18 so as to be aligned with equal intervals in parallel with those heater units 15 and 16. Those 8 heater units 11-18 are feedback-controlled independently (or after combined by every several units).</p>
申请公布号 JPH11354528(A) 申请公布日期 1999.12.24
申请号 JP19980163630 申请日期 1998.06.11
申请人 TOSHIBA MACH CO LTD 发明人 KATSUMATA HIROFUMI;MITANI SHINICHI
分类号 H01L21/683;H01L21/205;H01L21/324;H01L21/68;(IPC1-7):H01L21/324 主分类号 H01L21/683
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