| 摘要 |
PROBLEM TO BE SOLVED: To prevent conduction particles contained in ACF from escaping from the bump faces of an IC chip and to permit a larger number of conduction particles to exist on the bump faces, at the time of making the IC chip provided with a plurality of bumps adhere to a substrate by ACF (anaisotropic conductive film). SOLUTION: An IC chip 1 which incorporates a semiconductor, has a plurality of bumps 2 exposed to outside and whose face provided with the bumps 2 is adhered to a substrate by ACF is installed. The height H of an outer part on at least one of a plurality of bumps 2 is set to be higher than the height (h) of an inner part. At the time of pressurizing ACF by the IC chip 1, conduction particles contained in ACF are prevented from escaping to the outer side of the bumps 2 by the outer part whose height is higher, and much more conduction particles are acquired by the bumps 2. |
