| 摘要 |
PROBLEM TO BE SOLVED: To increase the adhesion between an inner layer board and an insulating resin layer at a place where through holes are crowded by treating the inner layer board with its roughed copper foil circuit coated on its surface with nickel and metal including nickel, with a silane compound expressed by a specific formula and then forming a curing insulating resin layer. SOLUTION: A silane compound expressed by a formula (X-CH2 )n-Si-(OR)4 -n, where 'n' is 1, 2, 3, R is an alkyl group having 1 to 3 carbons, X is a glycidyl group, mercapto group, or amino group, or a secondary amine, is attached to the surface of an inner layer board and then is heated and dealcoholized to be chemically bonded with resin-made sections of an inner layer circuit and inner layer board. The inner layer circuit is preliminarily roughened chemically by an etchant for the purpose of obtaining the good adhesion between the inner layer circuit formed with a fine pattern and an insulating resin layer and also roughening end faces of a copper foil generated after formation of the pattern. The inner layer circuit is chemically roughed after being formed with the circuit pattern and then is coated with the insulating resin layer. As for the insulating resin for coating the surface of the copper foil, epoxy resin, acrylic resin or the like can be used. |
