MANUFACTURE ON OPENED SPHERIC LATTICE ARRAY PACKAGE TECHNOLOGY

摘要

PROBLEM TO BE SOLVED: To make the process of a package consistent and perfect by reducing the volume of the product by sticking a surface having chip connecting legs to a substrate by accurately positioning the surface to the specific spot of the substrate, connecting a connecting line and passing a connecting line circuit through the opening of the substrate as a passage. SOLUTION: Since a chip 10 is stuck to a substrate 50 in a face-down state and the periphery of the chip 10 is packaged with a packaging material 40, the connecting legs of the chip 10 are faced to the substrate 50. Openings for passing connecting lines 30 are formed through the substrate 50 at the positions corresponding to the connecting legs of the chip 10. Since a connecting passage is formed by positioning the connecting legs provided successively from the chip 10 to spheric lattice array contacts 60 on the lower surface of the substrate 50, the circuits of all connecting lines 30 are positioned between the chip 10 and substrate 50. Therefore, the occupying area of the chip 10 is small and meets the requirements for the outward appearance and size of a chip scale package (CSP).