发明名称 ELECTRONIC COMPONENT HOUSING TAPE AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To lessen the mis-setting of components to avoid causing defectives by distributing component information, by which housed electronic components are recognizable at a glance at proper intervals, on an electronic component housing tape. SOLUTION: Component information 8 are printed in a step of manufacturing a housing tape 1 and distributed on the housing tape 1, the distribution intervals of the information 8 may be every component or every 5 components if electronic components 3 in an electronic component housing 2 are small. By adding an alphanumerical or bar-code printing step to the electronic component housing tape 1 manufacturing step, the component information can be distributed simply on the electronic component housing tape back side, the electronic component mounting part vacuum-chucks electronic components 3 from an electronic component feed cassette wound up by a reel 6, and the component information 8 on the component housing tape back side are read by sensors, with moving a moving stage, and compared with stored set information to mount at specified positions on a printed board.
申请公布号 JPH11354984(A) 申请公布日期 1999.12.24
申请号 JP19980156483 申请日期 1998.06.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKADA YASUHIRO;INUZUKA RYOJI
分类号 H05K13/02 主分类号 H05K13/02
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