发明名称 CHIP PARTS AND MOUNTING METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide chip parts which hardly cause a positional deviation against a suction nozzle, even when the nozzle is moved at a high speed after the nozzle sucks the parts. SOLUTION: Of the whole surface of chip parts 1, the surface (peripheral surface) of the case 5 of the parts 1 are formed as nozzle sticking area by vacuum. The parts 1 are mounted on a substrate, etc., by means of a suction nozzle in such a way that the nozzle sucks the nozzle sucking area. In order to secure such an appropriate friction that can stand against the positional deviation between the parts 1 and nozzle when the nozzle sucks the surface of the case 5 (nozzle sucking area) of the parts 1 and is moved at a high speed, the surface roughness (average surface roughness Ra) of the armor 5 is adjusted to 0.1-5μm, preferably, to 0.1-3μm. When the surface roughness of the case 5 is adjusted in this way, the positional deviation of the parts 1 against the nozzle can be prevented surely even when an air drag, slight vibrations, etc., are applied to the parts 1 at the time of moving the nozzle at a high speed after the nozzle sucks the parts 1.</p>
申请公布号 JPH11354301(A) 申请公布日期 1999.12.24
申请号 JP19980155826 申请日期 1998.06.04
申请人 SONY CORP;TAIYO YUDEN CO LTD;CHUKI SEIKI KK 发明人 IMAI MIKITO;KURATA SADAAKI;HARADA SHINICHI;AZUMA TOMIO;KAKIUCHI IKUO;TERAOKA MANABU
分类号 H01C7/00;(IPC1-7):H01C7/00 主分类号 H01C7/00
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