| 摘要 |
PROBLEM TO BE SOLVED: To prevent degradation in reliability including moisture proof due to microcrack or damage caused by solidification and contraction of solder or thermal warpage of a wiring board in flow soldering, and also by nozzle suction or press of an automatic mounting machine when soldering the wiring board, etc., with the automatic mounting machine to locally apply much stress to a layered ceramic electronic part. SOLUTION: A layered ceramic capacitor 10 comprises a material 12 which is made of a plurality of ceramic layers and internal conductive layers laminated and formed by laminating a couple of protective layers 20 on the outmost layers, and a couple of external electrodes 14 which are formed on both ends of the element body. In this case, R1 /R2 ranges 0.7 to 0.97, where R1 is the mean diameter of ceramic particles of which the protective layer ranging from its surface to at least 50 micrometers is formed, and R2 is the mean diameter of ceramic particles of which the ceramic layer is formed. |
