| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily joint a semiconductor device mounting board with a solder, by a method wherein at least a part forsolder joining the semiconductor device mounting board of a base material in which fibers or particles of a low expansion coefficient are compounded with a high heat conductivity metal is coated with an Ni alloy layer. SOLUTION: SiC fibers (diameter of 0.3μm and length of 90μm), AlN fibers (diameter of 1μm and length of 30μm), or carbon fibers (diameter of 10μm and length of 200μm) are formed as a porous fiber perform of 50 volume %. The perform is set in a pressurizing casting device having a cavity of the same shape as the porous fiber perform, an Al-13 wt.% Si alloy molten metal is injected to the cavity, thereby manufacturing a composite base material 1 by pressurizing and casting. Furthermore, the composite base material 1 is dipped in an alkaline liquid at 50 deg.C for 40 sec. to degrease and each, and next a zincate processing dissolution in nitric acid and a zincate processing are sequentially performed, and next various coated layers are plated so that the outermost layer is an Ni alloy layer 2, thereby attaining a heat sink.
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