摘要 |
PROBLEM TO BE SOLVED: To measure with a high sensitivity by avoiding a decrease in a heat quantity to be measured or scattering. SOLUTION: A sensor chip B is integrated with a thermal resistance modulating actuator chip C via a metal bump D. An infrared absorber 9 for converting an incident infrared ray hνinto a heat is provided at a membrane 8 of the chip B, and an oscillatory flap 17 opposed to the absorber 9 is provided at the chip C. When an alternating voltage is applied to metal wirings provided at the absorber 9, an electrostatic attraction force is developed to oscillate the flap 17. A thermal resistance of a heat transfer medium between the chip B and the chip C is changed by the oscillation of the flap 17, thereby applying a modulation to a temperature difference. Thus, since the modulation is not applied to the ray hνbut its temperature difference is modulated by changing the resistance of the medium, a decrease in a heat quantity to be measured or scattering is avoided, thereby measuring it with a high sensitivity.
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