| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent a wiring board region from falling off a frame region, improve yield and reduce the manufacturing cost by eliminating the problem of insufficient strength at bonding due to the step-difference between the wiring board region and the frame region, a problem of thin burr generation, etc., and forming a continuous part to the wiring board region. SOLUTION: In this frame type board, at least one wiring board region 9 containing a wring pattern 11 formed around a semiconductor element mounting part 10 on an insulating board 1, and a connection electrode electrically connected with the wiring pattern 11, a push-back region 12 which has a frame region 1f which is continuous with the periphery of the wiring board region 9 and is returned after punching to a frame region 1f which surrounds the wiring board region 9, and a region yet to be subjected to push-back where the wiring board region 9 is left as a continuous part 13 for retaining the frame region 1f is installed. By using the frame type board, a resin encapsulating type semiconductor device is manufactured. |
