PACKAGE FOR SPHERICAL IC, CIRCUIT BOARD FOR SPHERICAL IC AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a package for accommodating a spherical IC where an integrated circuit is formed on the surface of a sphere. SOLUTION: A package body 10 of insulator is provided with a recess 20 to be fitted with a spherical IC 30. A line 50 to be connected electrically with the electrode of an integrated circuit formed on the surface of the sphere 32 of a spherical IC 30 is provided on the surface of the package body 10 around the recess 20. Inner end of the connecting line 50 is located at the circumferential fringe of the opening at the upper end of the recess 20 such that the electrode of the integrated circuit of the spherical IC 30 fitted in the recess 20 can be connected with the inner end of the connecting line 50 by soldering, or the like.