发明名称 THIN FILM CAPACITOR AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To suppress the oxidation of TiN and Ti, deterioration of the surface morphology of an Ru film, oxygen insufficiency of a BST (dielectric layer), etc., by forming oxygen diffusion preventing layers among Ru particles constituting first electrodes. SOLUTION: Oxygen diffusion preventing layers 7 are formed in such a way that, after an Ru layer 6 and an SiO2 layer 2 are formed, the SiO2 layer 2 is removed by polishing the layer 2 until the surface of the Ru layer 6 is exposed by chemical mechanical polishing, and the layers 7 are formed among the Ru particles of the Ru layer 6. Consequently, the oxygen diffusion from the spaces among the Ru particles of the Ru layer 6 can be prevented remarkably and, accordingly, the oxidation of a TiN layer 5 and a Ti layer 4 can be prevented. Since the grain boundaries of the Ru layer 6 are filled up with the oxygen diffusion preventing layers 7 and the oxidative reaction of the Ru layer 6 only occurs near the surfaces of the Ru layer 6, the deterioration of the surface morphology of the Ru film 6 which is the second problem awaiting solution the oxygen insufficiency of a BST which is the third problem to be solved can also be solved.
申请公布号 JPH11354732(A) 申请公布日期 1999.12.24
申请号 JP19980155538 申请日期 1998.06.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OTSUKA TAKASHI;UEDA MICHIHITO
分类号 H01L27/108;B82B1/00;H01L21/8242;H01L21/8246;H01L27/105 主分类号 H01L27/108
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