| 摘要 |
<p>PROBLEM TO BE SOLVED: To relax the resonance effect ascribable to a metal material, by molding a signal converting means and a signal processing means with a molding material. SOLUTION: At specified positions on a wiring board 17 functional components such as signal processor 14 of IC components, etc., SAW filter 15, chip components 16, etc., are mounted, a light receiving element is mounted in a package and sealed to form a signal converter 13, this structure is set at specified position in a resin pouring lower die, an upper die is mated from above to hold the structure in a cavity defined by the mated upper and lower dies, and a sealing resin 100 is poured in the cavity. The resin 100 is used as a mold material for sealing a part of the structure including the signal converter 13 and signal processor 14 whereby the resonance effect ascribable to opposed metal materials can be relaxed.</p> |
