| 摘要 |
PROBLEM TO BE SOLVED: To improve quality, to miniaturize a device and to enhance capability in the semiconductor device. SOLUTION: A multilayer wiring substrate 2 where bonding electrodes are installed in multiple stages around cavity parts 2a supporting a semiconductor chip 1, the bonding electrodes installed at the outermost stage are arranged in two columns on an inner side and an outer side and a power electrode 2d being the inner bonding electrode is installed in a thin part 2b whose thickness is thinner than a signal electrode 2c being the outer bonding electrode, bonding wires 3 connecting the pad 1a of the semiconductor chip 1 and the respective bonding electrodes of the multilayer wiring board 2 and a sealing part 4 sealing the semiconductor chip 1 and the wires 3 are installed. The wire 3 connected to the power electrode 2d and the wire 3 connected to the signal electrode 2c can be arranged without shorting them by installing the power electrode 2d in the thin part 2b. |
