| 摘要 |
PROBLEM TO BE SOLVED: To probe even with respect to a solder ball already mounted on a device, etc., by a method wherein a probe is inserted from a side face of a BGA type package substrate into the interior, and a hole which can come into contact with a conductive part in the substrate is provided. SOLUTION: Hole main bodies 13-1,... are opened on one side face of a substrate 10a, and the interior of the substrate is formed parallel to the upper face thereof along each array of a solder ball arrays 12-1,.... Furthermore, a plurality of trench parts 13-1a,... are formed in a recessed manner facing a side of solder balls 12-1a,... to a hole longitudinal direction in response to the solder balls 12-1a,... provided in a column, in each of the hole main bodies 13-1,.... And, in a state that a contact rod 1a is fitted on the desired trench parts 13-1a,..., when a probe 1 is rotated about an axis, the contact rod 1a rotates along an arc-shaped wall face of the trench parts 13-1a,... and comes into contact with a desired conductive part 14. Thus, probing can be performed with respect to each of the solder balls 12-1a,... which is electrically connected to the conductive part 14. |
