发明名称 ADHESIVE-BACKED TAPE FOR TAB, AND TAB TAPE AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the adhesiveness, insulation property, and workability of an adhesive-backed tape, by mixing at least a thermoplastic resin and a phenol resin as essential ingredients in the adhesive layer of the tape, and specifying the softening point of the phenol resin. SOLUTION: The adhesive layer formed on an adhesive-backed tape contains at least a thermoplastic resin (A) and a phenol resin (B) as essential ingredients. While any thermoplastic resin can be used as the thermoplastic resin (A) as far as the resin gives flexibility to the adhesive layer, an embodiment of the resin includes polyethylene, polyamide, etc. It is preferable to specify the softening point of the phenol resin (B) to <=85 deg.C and, more preferable, to <=80 deg.C. When the softening point is >=85 deg.C, the well-known novolak and resol resins can be used without restriction. It is also preferable to adjust the mixing ratio of the phenol resin (B) in the adhesive to 35-60%.
申请公布号 JPH11354592(A) 申请公布日期 1999.12.24
申请号 JP19990079508 申请日期 1999.03.24
申请人 TORAY IND INC 发明人 MIZUTANI YOKO;KIGOSHI SHOJI;KONISHI YUKITSUNA
分类号 H01L21/60;C09J7/02;C09J161/06;C09J163/00;C09J177/00 主分类号 H01L21/60
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