ELECTRONIC CIRCUIT DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a small and highly reliable electronic circuit device exhibiting higher heat dissipation effect as compared with conventional one. SOLUTION: The electronic circuit device comprises a metallic substrate 31 having first and second sides with electronic parts being mounted only on the first side, a case 32 formed integrally with fins 39 and containing the metallic substrate 31 as a cover, and a resin filling the gap between the metallic substrate 31 and the case 32. The metallic substrate 31 directs the first side toward the case 32 and dissipates heat generated from the electronic parts to the outside from both the fins 39 and the second side of the metallic substrate 31.