发明名称 WAFER POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To eliminate the need for using a rotary reversing mechanism which cannot ensure sufficient sealing performance, by providing an unloader part receiving a polished wafer from a polishing head with a reversing mechanism for turning the wafer upside down. SOLUTION: An unloader part 11 having a wafer-reversing unit comprises a pair of claws 13, a twin cylinder 14, a rotary shaft 15, a bearing 16, a rotary actuator 17, a cylinder 18 moving up and down, and a cylinder 19 moving horizontally. A wafer 10 is pinched with the pair of claws 13 at the side of the peripheral portion thereof, the pair of claws 13 is fixed to the tip of the rotary shaft 15 via the twin cylinder 14, and the rotary shaft 15 is held by the bearing 16. The twin cylinder 14 opens and closes the claws 13 and the rotary actuator 17 is joined to the rear end of the rotary shaft 15 with the bearing 16 therebetween. The rotary actuator 17 rotates the rotary shaft 15 to turn the wafer 10 upside down.
申请公布号 JPH11354475(A) 申请公布日期 1999.12.24
申请号 JP19980154671 申请日期 1998.06.03
申请人 TOSHIBA MACH CO LTD 发明人 SUGIYAMA HISATAKA;SAITO HIDEO;SUZUKI HIROYUKI
分类号 H01L21/677;H01L21/304;H01L21/68;(IPC1-7):H01L21/304 主分类号 H01L21/677
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