| 摘要 |
PROBLEM TO BE SOLVED: To avoid deteriorating elements during wire-bonding wherein a plurality of semiconductor chips are electrically connected and packaged. SOLUTION: First and second semiconductor chips 50, 51 are fixed onto islands 60 while openings 56 are provided at corresponding islands 54 to form bridges 57, the bridges and semiconductor chips are connected by ball-bonds of bonding pads at the semiconductor chips and stitch-bonding the pads at the bridges, and considering the penetrating of noise from the bridges, the installation of spacers 84 or tight fixing with insulative adhesives may be adopted. |
