| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having high bonding strength and excellent in reliability in which reliability test causes no deterioration of strength by bonding solder balls to a substrate where a wiring pattern is formed without leaving any air between the substrate and a solder resist provided on the wiring pattern while opening partially. SOLUTION: When a solder resist 3b is provided on a wiring pattern 2b while opening partially in order to bond solder balls 7 to the wiring pattern 2b on a substrate 1, air vents 9 extending partially outward from the joint of the solder ball 7 and the wiring pattern 2b are opened 8 excessively and the solder ball 7 are bonded through the openings 8.</p> |
