| 摘要 |
PROBLEM TO BE SOLVED: To improve the connection intensity of bonding in ball bonding. SOLUTION: A capillary 3 where a wire guide hole 3c is formed inside and recessed parts 3b being thin annular grooves are formed at tip faces 3a pressurizing the wire connection part of a wire at the time of bonding and a bonding processing part bonding the wire by the capillary 3 are provided. At the time of pressurizing the wire connection part by the capillary 3 and bonding the wire, wire side projection parts are formed in the wire connection part by the thin annular recessed parts 3b in the tip face 3a of the capillary 3, and the wire connection part is pressurized. |
