| 摘要 |
PROBLEM TO BE SOLVED: To prevent damages to a semiconductor package important structural part, by a method wherein, in a molding process of a ball grid array semiconductor package manufacture, electrostatic charges generated by friction at the time of a fusion molding resin inflow are instantly released into a mold via a ground part. SOLUTION: A grounding via hole 21 is electrically connected to a plate-like ground part 20 via a grounding trace 22, and also electrically connected to a grounding trace on the upper face of a printed circuit board 10. The plate-like ground part 20 is formed so as to project a little more than a peripheral region so as to come into direct contact with a mold. Furthermore, a mold runner gate 17 formed of a conductive metal such as gold, palladium, etc., at a corner part on one side on an upper face of the printed circuit board 10 is electrically connected to the plate-like ground part 20 formed on a bottom face of the printed circuit board 10. Thus, it is possible to prevent electrostatic charges from accumulating at the time of resin molding and prevent a semiconductor package important structural part from being damaged. |
