| 摘要 |
PROBLEM TO BE SOLVED: To meet the requirements for the reduction of the thickness, size, weight, of a semiconductor device without increasing the cost, by providing second electrode pads which are electrically connected to first electrode pads in a circuit forming area, and providing bumps which are electrically connected to the second electrode pads on the surface of a sealing resin. SOLUTION: First electrode pads (electrode pads 3) are electrically connected to an electronic circuit formed on the surface of a semiconductor chip 1. Second electrode pads (electrode pads 4) are formed in a circuit forming area in which the electronic circuit is formed on the surface of the chip 1. Wiring layers 5 electrically connects the electrode pads 3 to the electrode pads 4. Therefore, the electrode pads 4 can be provided at arbitrary positions on the surface of the chip 1. In addition, the chip 1 is also provided first and second bumps 6 and 7 and a sealing resin 2. The sealing resin 2 protects the electronic circuit, etc., formed on the surface of the chip 1 by sealing the surface of the chip 1. |
