发明名称 METHOD AND DEVICE FOR PRODUCING IC CARD
摘要 PROBLEM TO BE SOLVED: To shorten the curing time of an adhesive by enclosing the IC units between two sheet members via an adhesive and with application of heat and pressure, cutting adhered sheet members into a single sheet and supplying water to the single sheet via a humidification zone. SOLUTION: The IC units 6 which are individually taken out are put between the 1st and 2nd sheet members 1 and 4, and both members 1 and 4 are intermittently pressed and heated at a thermal press part 72. Thus, the adhesive consisting of gel thermosetting resin of the members 1 and 4 is cured to enclose the units 6. Then an image receiving layer coating liquid 33 is applied on one of both sides of a film substrate 11 at a coating part 90. Meanwhile, a writing layer coating liquid 63 is applied on another side of the substrate 11. Thus, an image receiving layer and a writing layer are formed. Then the members 1 and 4 are cut into the single sheet member 85 at a cutting part 84, and the water is supplied to the members 85 via a humidification zone 95.
申请公布号 JPH11353449(A) 申请公布日期 1999.12.24
申请号 JP19980163167 申请日期 1998.06.11
申请人 KONICA CORP 发明人 KATO TOSHIO;YAMAUCHI MASAYOSHI;WATANABE HIROSHI;TSUDA TAKAO
分类号 B42D15/10;G06K19/077 主分类号 B42D15/10
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