| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chemical treating device which can prevent the floating of an object to be treated due to bubbles in a chemical, and can secure its operational stability and productivity. SOLUTION: Wafers 5 carrying resists formed on their surfaces are placed on the wafer supporting section 4 of a chemical tank 1 and dipped in a chemical 10. Then a wafer retaining section 3 is turned to a point above the tank 1 form the rear side of the tank 1 around a rotating shaft 9. Consequently, the resists on the surfaces of the wafers 5 and by-products react to the chemical 10 and bubbles are produced around the wafers 5. Even when the bubbles are produced, the wafer retaining section 3 suppresses the floating of the wafers 5. The bubbling continues for about two to three minutes. When the bubbling ends and the resists on the surfaces of the wafers 5 are nearly completely stripped removed front the surfaces of the wafers 5, the wafers 5 are released from the retained states by turning the retaining section 3 backward and carried out by means of a robot hand.</p> |
