MANUFACTURE OF RESIN-ENCAPSULATED CHIP BODY

摘要

PROBLEM TO BE SOLVED: To improve the working efficiency and facilitate management of steps by sealing at the same time a plurality of chips with a resin, without using molds. SOLUTION: According to this method of manufacturing a resin-encapsulated chip body, a plurality of chip bodies 1 are mounted on a lead frame 2, the lead frame 2 with the chip bodies 1 mounted thereon is placed on a tape 4 having a heat resistant base 3, and a thermosetting resin 5 is injected or applied, in such a way as to cover the chip bodies 1 and the lead frame 2. Then, thermosetting is performed to encapsulate the chip bodies 1 and the lead frame 2 with the resin, and the resin-encapsulated structure is cut away chip body by chip body.